Active and Passive Electronic Components

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List of Papers (Total 109)

An Inexpensive Thick Film Furnace

The centre of any thick film teaching or research establishment is the furnace for firing the thick film pastes. These are usually large and expensive belt furnaces. This article discusses the design and manufacture of an inexpensive three zone belt furnace of moderate size, which any reasonably well equipped college, university or small manufacturer could assemble.

Conduction Processes in Thick Film Resistors. Part I

The structures of three families of thick film resistors have been investigated by scanning electron microscopy and electron probe micro-analysis. The two principal components of the resistive glazes, that is the conducting pigment and the glassy binder, have been identified in each case. The pigments were found to be simple or ternary oxides of the Pt transition metal group and...

Principe d'un Analyseur de Spectre Optique Utilisant les Couches Minces Pulverisees

Cette étude décrit le principe d'un analyseur de spectre optique entre 2000 Å et 7000 Å, utilisant les propriétés spécifiques de l'effet photovoltaïque apparaissant dans les structures sandwich de faible épaisseur. La mesure des longueurs d'onde est liée à la détermination du point de renversement de la tension photovoltaïque en circuit ouvert; le courant de court-circuit étant...

Evaporation Characteristics of Electron Beam Gun Heated Sources

Exact expressions for the thickness profile of thin films deposited using electron beam gun heated sources are obtained in terms of the source-substrate geometry. Calculations based on conical and cylindrical indentations show the latter to be more realistic. Self-masking effects at the source are taken into account.

AG-Based Thick-Film Front Metallization of Silicon Solar Cells

The evolution of microstructure and electrical properties of silver-based thick-film metallizations of silicon solar cells prepared by infrared firing processes has been investigated. The performance of the cells are shown to be dependent on several dynamical and diffusive phenomena. In particular, the sintering of silver grains, silver diffusion into the glass, and the flow of...

Electronic and Magnetic Properties of Fe2N and FeN: Trends of the Magnetism of the Fe-N System

The electronic and magnetic properties of the nitrides Fe2N and hypothetical FeN were investigated by use of the ASW method. For both nitrides, the calculations were done in the orthorhombic structure of Fe2N for the two nitrides. The magnetization is low (0.95 μB/at.) for Fe2N and vanishes for FeN. The decrease of the magnetization with increasing amount of N is assessed within...

A New Method for the Preparation of Fine-Grained SnO2 and WO3 Powders: Influence of the Crystallite Size on the Electrochemical Insertion of Li+ in SnO2 and WO3 Electrodes

We propose an unconventional method to obtain fine-grained SnO2 and WO3 powders. It uses as precursors, polymer complexes between polyethylene oxide (POE) and SnCl4 or WCl6 respectively. By pyrolysis of these complexes in the 350-550℃ temperature range, metal-oxide powders possessing small crystallite sizes are obtained. They are free from water and hydroxyl group contaminations...

Universal Current-Conveyor-Based Current-Mode Filters with Single Input and Three Outputs

Universal active current-mode filters with single input and three outputs are presented. The proposed filters avoid the use of external feedback in any part of the circuit and use grounded resistors and grounded capacitors. The proposed circuits can simultaneously realize lowpass, highpass, and bandpass filter functions.

Harmonic and Intermodulation Performance of Nonlinear Electronic Circuits

A unified technique for mathematical modelling of the input output characteristics of nonlinear electronic circuits is presented. This technique can be easily implemented using simple hand computations without recourse to standard curve-fitting techniques, which invariably requires extensive computing facilities and well-developed software. The mathematical model, basically a...

Chemical Etching of {hk0} Silicon Plates in EDP Part I: Experiments and Comparison with TMAH

This paper deals with the anisotropic chemical etching of various silicon plates etched in EDP. Changes with orientation in geometrical features of etched surface and in the etching shape of starting circular sections are systematically investigated. These etching shapes are compared with shapes produced by etching in KOH and TMAH solutions; This experimental study allows us to...

Announcements

Low Frequency Characteristics of TiO2(Rutile)–Glass Thick Films

An analysis is made of the low-frequency characteristics of the permittivity ε′ and of tan δ of a thick-film insulator containing rutile grains bonded with an amorphous glass. The appearance of dielectric relaxation associated with a maximum of tan δ, as well as characteristic Debye dispersions of the electric permittivity is observed. The relaxation time does not depend on the...

Criteria of Low-Noise Thick-Film Resistors

Our simple model of the noise of a thick-film resistor leads to two limiting cases. For thick-film resistors with a conduction dominated by the glass interface, the relative noise is proportional to the sheet resistance, R□. For thick film resistors, where the conduction is mainly dominated by the current constrictions in the contact areas between grains, the relative noise is...

Improvement of Adhesion, Line Definition, Contact Resistance and Semiconductor Properties by Sputter-Etching

In an RF-sputtering unit, with suspended substrates mounted in lieu of a target, sputter-etching of the substrates and consecutive vapor deposition of Au is performed in order to achieve good adhesion of the Au-film without an adhesion layer. The method has been applied for surface-acoustic-wave filters on piezo ceramics and for noise measurements in Au-films on sapphire. The...

Tantalum Thin Film Capacitors With Various Types of Counterelectrodes

Capacitors have been prepared from N2-doped, triode sputtered Tantalum films by conventional anodization and photolitographic techniques.

Book Reviews

A New Approach to the Topological Design of Hybrid Circuits

A computer-aided topological hybrid layout-design procedure is proposed, that yields the wanted principal routing in the form of a geometrical planarization graph. A so-called grid-embedding of a circuit graph into the Euklidean plane enables us to observe all except one of the various technological constraints. The real problem is reduced to finding a proper arrangement of “nets...

Heat Treatment of CdSe Thin Films and Application to Photopotentiometers

Effects of heat treatment have been studied in a nitrogen atmosphere for improving the characteristics of poor photoconductive CdSe evaporated films. The following results were obtained. At first light resistance and dark resistance greatly decrease after the heat treatment of evaporated films in a pure nitrogen atmosphere for an hour. The ratio of dark resistance to light...

Processing Considerations of Thick Film Devices With Multilayered Resistors

The results of a study into the fabrication of thick film multilayer devices which include resistors on and under the thick film dielectric layers are presented. Although the resistive values of the resistors under the dielectric change in the succeeding firing processes are influenced by the geometry of the resistors, the ratio of the resistivity change in resistors fabricated...

Application-Oriented Description of the Quality of Electronic Components (ppm Concept)

Traditionally the production quality of components is described by “acceptable quality levels” (AQL). Agreements, referring to this principle, determine the acceptance or refusal of batches that have been sample tested. An acceptable quality of level is interpreted as a tolerated limit. In reality true values of quality must be better. An AQL value cannot define a real quality...