Active and Passive Electronic Components

https://www.hindawi.com/journals/apec/

List of Papers (Total 34)

An Inexpensive Thick Film Furnace

The centre of any thick film teaching or research establishment is the furnace for firing the thick film pastes. These are usually large and expensive belt furnaces. This article discusses the design and manufacture of an inexpensive three zone belt furnace of moderate size, which any reasonably well equipped college, university or small manufacturer could assemble.

Electronic and Magnetic Properties of Fe2N and FeN: Trends of the Magnetism of the Fe-N System

The electronic and magnetic properties of the nitrides Fe2N and hypothetical FeN were investigated by use of the ASW method. For both nitrides, the calculations were done in the orthorhombic structure of Fe2N for the two nitrides. The magnetization is low (0.95 μB/at.) for Fe2N and vanishes for FeN. The decrease of the magnetization with increasing amount of N is assessed within...

A New Method for the Preparation of Fine-Grained SnO2 and WO3 Powders: Influence of the Crystallite Size on the Electrochemical Insertion of Li+ in SnO2 and WO3 Electrodes

We propose an unconventional method to obtain fine-grained SnO2 and WO3 powders. It uses as precursors, polymer complexes between polyethylene oxide (POE) and SnCl4 or WCl6 respectively. By pyrolysis of these complexes in the 350-550℃ temperature range, metal-oxide powders possessing small crystallite sizes are obtained. They are free from water and hydroxyl group contaminations...

Announcements

Criteria of Low-Noise Thick-Film Resistors

Our simple model of the noise of a thick-film resistor leads to two limiting cases. For thick-film resistors with a conduction dominated by the glass interface, the relative noise is proportional to the sheet resistance, R□. For thick film resistors, where the conduction is mainly dominated by the current constrictions in the contact areas between grains, the relative noise is...

Improvement of Adhesion, Line Definition, Contact Resistance and Semiconductor Properties by Sputter-Etching

In an RF-sputtering unit, with suspended substrates mounted in lieu of a target, sputter-etching of the substrates and consecutive vapor deposition of Au is performed in order to achieve good adhesion of the Au-film without an adhesion layer. The method has been applied for surface-acoustic-wave filters on piezo ceramics and for noise measurements in Au-films on sapphire. The...

Tantalum Thin Film Capacitors With Various Types of Counterelectrodes

Capacitors have been prepared from N2-doped, triode sputtered Tantalum films by conventional anodization and photolitographic techniques.

Book Reviews

A New Approach to the Topological Design of Hybrid Circuits

A computer-aided topological hybrid layout-design procedure is proposed, that yields the wanted principal routing in the form of a geometrical planarization graph. A so-called grid-embedding of a circuit graph into the Euklidean plane enables us to observe all except one of the various technological constraints. The real problem is reduced to finding a proper arrangement of “nets...

Processing Considerations of Thick Film Devices With Multilayered Resistors

The results of a study into the fabrication of thick film multilayer devices which include resistors on and under the thick film dielectric layers are presented. Although the resistive values of the resistors under the dielectric change in the succeeding firing processes are influenced by the geometry of the resistors, the ratio of the resistivity change in resistors fabricated...

Application-Oriented Description of the Quality of Electronic Components (ppm Concept)

Traditionally the production quality of components is described by “acceptable quality levels” (AQL). Agreements, referring to this principle, determine the acceptance or refusal of batches that have been sample tested. An acceptable quality of level is interpreted as a tolerated limit. In reality true values of quality must be better. An AQL value cannot define a real quality...

Hybrid Circuit for Stimulated Bone Regrowth

A hybrid circuit using a custom-designed I2L IC for a four-channel implantable biotelemetry system together with a HF transmitter has been designed. It realises a high-performance and economical device.

Mid-Film Interconnects for Multilayer Microcircuit Packages

The mid-filmR process has been developed to combine the photolithographic capability of thin film technology and the low cost, non-vacuum processing of thick film technology. In this paper, we present results on the characterization of mid-film gold for multilayer applications. The effects of various processing parameters on the properties of the conductor were investigated to...

Optical Fibre Connectors for Harsh Environments

This paper describes the construction of a multiway Optical Fibre connector suitable for harsh environments, based on a ruggedised marine connector (Patt 608) shell, and employs expanded-beam principles. The connector utilises an array of sapphire sphere lenses force-fitted into a metal plate forming a flat mating surface with all the precision parts protected behind the lenses.

Comment on the Dependence of R□ and Current Noise on Grain Size in Thick Film Resistors (TFR's)

The heterogeneous structure of TFR's results in high resistivities and high current noise. Accepting models of conduction in TFR's, according to which the resistivity is determined by a resistance independent of bulk-resistivity of a metallic-like component, it will be shown, that R□ and Ceff*(describing current noise behaviour) increase with d and d3, respectively, when d is the...

Relationship Among Preparation, Structure and Superconductivity in Ti-Ca-Ba-Cu-O Compounds

Analysis of a comprehensive set of experimental results has proven the substantial effect of the precise preparation conditions upon the structure and superconducting parameters of Ti-Ca-Ba-Cu-O samples. The techniques required for the preparation of specimens of single phase and long-term stability, together with methods for improvement of the characteristic parameters have been...

Influence of Time-Dependent Power Dissipations on the Ageing Behavior of Thick-Film Resistors

Reliability experiments on hybrid circuits are usually carried out by accelerated ageing test. The circuits or the components under test are stored at an elevated ambient temperature and the change of their electric properties is controlled at regular times. The situation becomes entirely different if the temperature rise is due to the power dissipation in the component under...

Novel CCI-OTA-Based Grounded Capacitor Current-Mode Biquadratic Bandpass and Lowpass Filters

A novel current-mode active filter topology using a first generation current conveyor (CCI) and an operational transconductance amplifier (OTA) is presented. Using this topology, grounded-capacitor biquadratic bandpass and lowpass filter sections, with at most five one-port passive elements, are realized. In these realizations, the parameter ω0 can be adjusted without disturbing...

Simulation of Open Circuit Voltage Decay for Solar Cell Determination of the Base Minority Carrier Lifetime and the Back Surface Recombination Velocity

The Open Circuit Voltage Decay (OCVD) method for the determination of the base minority carrier lifetime (τ ) and the back surface recombination velocity (S) of silicon solar cells has been investigated at constant illumination level. The validity of the method has been discussed through a simulation study by considering the mathematical solution of the continuity equation...

Electrostatic Repulsion Between Highly Injecting Metals: An Experimental Investigation

This paper is an experimental investigation of the major implications brought in the crossing resistance of mechanically contacted metals when operating in the high electronic injection regime, i.e., steady state interfacial voltage values greater than the max. acceptable level determined by specifications and less than the melting voltage. Under such operating conditions...

New Universal Filter Using Two Current-Feedback Amplifiers

A new universal voltage-mode second-order filter circuit is presented. The circuit has three inputs and one low-impedance output and can realize all the standard filter functions; lowpass, highpass, bandpass, notch, and allpass, without changing the passive elements. The proposed circuit uses only five passive components and enjoys independent control of the natural frequency and...

A Study on the Transversal Optical Mode in Amorphous Gallium Arsenide

Contributions to the far-infrared spectrum corresponding to both dynamical and structural disorders in a-GaAs are examined when frequency coincides with the transversal optical mode. Under these circumstances, dipole moment matrix element is discussed.

Using Spice Circuit Simulation Program in Reliability Analysis of Redundant Systems with Non-Repairable Units and Common-Cause Failures

The effectiveness of Simulation Program with Integrated Circuit Emphasis (SPICE) in calculating probabilities, reliability, steady-state availability and mean-time to failure of redundant systems with non-repairable units and common-cause failures described by Markov models is demonstrated. General equations and procedure for constructing the equivalent circuit for N parallel...