Wavelength-multiplexed multi-mode EUV reflection ptychography based on automatic differentiation
Shao et al. Light: Science & Applications (2024)13:196
https://doi.org/10.1038/s41377-024-01558-3
Official journal of the CIOMP 2047-7538
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ARTICLE
Open Access
Wavelength-multiplexed multi-mode EUV
reflection ptychography based on automatic
differentiation
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Yifeng Shao
1,2 ✉
, Sven Weerdenburg
1
, Jacob Seifert2, H. Paul Urbach1, Allard P. Mosk
2
and Wim Coene
1,3
Abstract
Ptychographic extreme ultraviolet (EUV) diffractive imaging has emerged as a promising candidate for the next
generationmetrology solutions in the semiconductor industry, as it can image wafer samples in reflection geometry at
the nanoscale. This technique has surged attention recently, owing to the significant progress in high-harmonic
generation (HHG) EUV sources and advancements in both hardware and software for computation. In this study, a
novel algorithm is introduced and tested, which enables wavelength-multiplexed reconstruction that enhances the
measurement throughput and introduces data diversity, allowing the accurate characterisation of sample structures.
To tackle the inherent instabilities of the HHG source, a modal approach was adopted, which represents the crossdensity function of the illumination by a series of mutually incoherent and independent spatial modes. The proposed
algorithm was implemented on a mainstream machine learning platform, which leverages automatic differentiation to
manage the drastic growth in model complexity and expedites the computation using GPU acceleration. By
optimising over 200 million parameters, we demonstrate the algorithm's capacity to accommodate experimental
uncertainties and achieve a resolution approaching the diffraction limit in reflection geometry. The reconstruction of
wafer samples with 20-nm high patterned gold structures on a silicon substrate highlights our ability to handle
complex physical interrelations involving a multitude of parameters. These results establish ptychography as an
efficient and accurate metrology tool.
Introduction
As the semiconductor industry advances along the trajectory projected by Moore’s law and approaches the
ability to manufacture 3D transistors with features on the
order of a few nanometres, conventional metrology
solutions are confronted with challenges in addressing the
shrinking dimensions when characterising the critical
dimensions and the overlay errors of the structures
printed on the wafer by lithography1,2. Due to its capability to perform non-invasive inspections of non-
Correspondence: Yifeng Shao ()
1
Imaging Physics Department, Applied Science Faculty, Delft University of
Technology, Lorentzweg 1, Delft 2628 CJ, The Netherlands
2
Nanophotonics, Debye Institute for Nanomaterials Science and Center for
Extreme Matter and Emergent Phenomena, Utrecht University, P.O. Box 80000,
Utrecht 3508 TA, The Netherlands
Full list of author information is available at the end of the article
These authors contributed equally: Yifeng Shao, Sven Weerdenburg, Jacob
Seifert.
isolated and non-periodic patterns, ptychography emerges as a promising candidate for next-generation
metrology solutions3–11, offering both amplitude and
phase information by means of diffractive imaging with a
superior resolution and a larger penetration depth into
the materials through the use of extreme ultraviolet
(EUV) illumination. As a computational approach, it does
not require expensive imaging optics, whose components
can be extremely challenging to fabricate for wavelengths
in the EUV regime12,13. Instead, it illuminates the sample
at overlapping areas during a scan process and reconstructs the image of the sample along with the illumination field from the diffraction patterns measured at the
corresponding
scanning
positions
via
iterative
optimisation14–16.
Compared to the enormous synchrotron or freeelectron laser facilities, the compact-sized table-top
sources based on high-harmonic generation (HHG) are
© The Author(s) 2024
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Shao et al. Light: Science & Applications (2024)13:196
ideal for industrial applications by providing a spatially
moderately coherent illumination consisting of spectral
harmonics in the EUV regime17–19. Owing to the overlap
between the illuminated sample areas at adjacent scanning positions, the dataset offers abundant information
with the necessary redundancy for phase retrieval of
illumination and sample fields20,21, allowing one to utilise
the advantage of the multiple spectral harmonics generated by the HHG source with wavelength-multiplexed
reconstruction22–25. In the meantime, one can also tackle
the inherent instabilities of the HHG source with ptychography using a modal approach, in which one reconstructs a series of mutually incoherent and independent
spatial modes of illumination instead of a single illumination field26–29.
Recent progress on HHG sources, especially the significant improvement in brightness and photon flux30,31,
enables data acquisition to be completed in a reasonable
timeframe and has brought EUV ptychography into the
spotlight as a potentially viable technology. However,
exploiting information redundancy in the dataset with
ptychography leads to a drastic growth in model complexity. To manage the entangled relations between
diverse physical processes, automatic differentiation
(AD)32 manifests as an ideal tool for building a universal
framework for ptychography models33–37 as well as other
computational
imaging
modalities38,39,
releasing
researchers from the laborious work of manually deriving
the formulas and implementing the routines for computing various gradients.
In view of metrology applications in the semiconductor
industry, it is desired to use a beamline in reflection
instead of transmission geometries5,9,10,24,25,40 for wafer
samples. Additionally, extending from single wavelength6–8,11 to multiple wavelengths can enhance the
measurement throughput and introduce data diversity,
allowing accurate characterisation of the structure information. Previous works of wavelength-multiplexed
reconstruction with HHG sources, however23,25,41, did
not incorporate (...truncated)