Investigating the potential variation of in-operando semiconductor nanostructures in electron beam direction
BIO Web of Conferences 129, 04020 (2024)
EMC 2024
https://doi.org/10.1051/bioconf/202412904020
Investigating the potential variation of in-operando
semiconductor nanostructures in electron beam
direction
Hüseyin Çelik1, Mr. Robert Fuchs2, Dr. Dirk Berger3, Dr. Christian M. Günther3,
Mr. Simon Gaebel4, Dr. Tolga Wagner5, Prof. Dr. Michael Lehmann1
1Technische Universität Berlin, Institute of Optics and Atomic Physics,
Germany, 2Technische Universität Berlin, Institute of Theoretical Physics,
Germany, 3Technische Universität Berlin, Center for Electron Microscopy
(ZELMI), Germany, 4Max-Born-Institut für Nichtlineare Optik und
Kurzzeitspektroskopie, Germany, 5Humboldt-Universität zu Berlin,
Department of Physics, Germany
Off-axis electron holography is a well-established method for the investigation
of projected potential distributions down to atomic spatial resolution.
However, in the case of in-operando (electrical biasing) investigations of
externally controlled semiconductor nanostructures, parasitic modulations of
the electron wave occur due to long-range electrostatic stray fields [1]. In
addition, a well-known problem is the alteration of the sample during
preparation using a focused ion beam (e.g. ion implantation, surface
amorphization or generation of conducting surfaces), which also severely
influences the potential distribution within the sample [2]. Both effects have a
particular impact in the direction of the electron beam as well, which makes a
quantitative analysis particularly difficult. Standard approaches to resolve the
entire potential distribution involve projective tilt series and their
tomographic reconstruction [3], which entail a significant measurement effort
(e.g. sample tracking or long-time stability) and instrumentational limitations
(e.g. limited tilt angle (i.e. missing wedge), interior Radon transform or
parallax displacement), in addition to extensive simulations (e.g. FEM or
DEM), which are highly computationally intensive and require rarely given
knowledge of the microscopic charge carrier distribution.
Here, a simple and intuitive model (SIMP) for the approximation of such
potential distributions inside and outside nanostructured FIB-prepared
samples of a p-n junction, requiring a limited set of parameters, is presented.
The model uses only independent convolutions of an initial potential
distribution (e.g. analytic textbook models) with a Gaussian kernel (see
attached figure), allowing the reconstruction of the entire potential
distribution from only one measured projection (electron hologram). In
addition, various contacted semiconductor nanostructure samples (TEMlamellae) are produced in a systematic approach using FIB under varying
preparation parameters (i.e. currents and acceleration voltages of the ions) to
evaluate the proposed model.
© The Authors, published by EDP Sciences. This is an open access article distributed under the terms of the Creative Commons
Attribution License 4.0 (https://creativecommons.org/licenses/by/4.0/).
BIO Web of Conferences 129, 04020 (2024)
EMC 2024
https://doi.org/10.1051/bioconf/202412904020
In comparison with FEM-simulations, representing an established simulation
method, it can be shown that the self-developed model is able to accurately
approximate the 3D electrostatic potential distribution of various contacted
TEM-samples, whereby the computational complexity can be significantly
reduced with respect to FEM-simulations (i.e. ~1000x faster with ~1/1000th of
the memory usage at ~5000x more nodes). An excellent agreement can
likewise be observed in comparison with electron holographic and
tomographic investigations considering experimental restrictions, revealing
the real potential distribution in propagation direction of the electron beam.
By this, a significant reduction of the required computational power as well as
a drastically simplified measurement process is achieved, paving the way
towards quantitative electron holographic investigation of electrically biased
semiconductor nanostructures. In particular, the latter can in turn also be
used to understand the exact effects of the FIB-preparation (e.g. implantation
concentration or implantation depth) on the sample, thus leading to
improved preparation strategies.
Graphic:
Keywords:
Electron-Holography, Semiconductor-Nanostructures, 3D-PotentialDistribution, Surface-Effects, Computational-Optimization
Reference:
[1] S. Yazdi et. al., Ultramicroscopy 152, 10 (2015).
[2] D. Cooper et. al., Journal of Microscopy 233, 102 (2009).
[3] A. C. Twitchett-Harrison et. al., Nano Lett. 7, 2020 (2007).
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