Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products

Journal of Remanufacturing, Dec 2011

This paper proposes and investigates the use of embedding sensors in products when designing and manufacturing them to improve the efficiency during their end-of-life (EOL) processing. First, separate design of experiments studies based on orthogonal arrays are carried out for conventional products (CPs) and sensor embedded products (SEPs). In order to calculate the response values for each experiment, detailed discrete event simulation models of both cases are developed considering the precedence relationships among the components together with the routing of different appliance types through the disassembly line. Then, pair-wise t-tests are conducted to compare the two cases based on different performance measures. The results showed that sensor embedded products improve revenue and profit while achieving significant reductions in backorder, disassembly, disposal, holding, testing and transportation costs. While the paper addresses the EOL processing of dish washers and dryers, the approach provided could be extended to any other industrial product.

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Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products

Mehmet Ali Ilgin 0 Surendra M Gupta 2 Kenichi Nakashima 1 0 Department of Industrial Engineering, Dokuz Eylul University , Buca 35160, Izmir, Turkey 1 Department of Information and Creation, Kanagawa University , Yokohama, 221-8686, Japan 2 Laboratory for Responsible Manufacturing, 334 SN Department of MIE, Northeastern University , Boston, MA 02115, USA This paper proposes and investigates the use of embedding sensors in products when designing and manufacturing them to improve the efficiency during their end-of-life (EOL) processing. First, separate design of experiments studies based on orthogonal arrays are carried out for conventional products (CPs) and sensor embedded products (SEPs). In order to calculate the response values for each experiment, detailed discrete event simulation models of both cases are developed considering the precedence relationships among the components together with the routing of different appliance types through the disassembly line. Then, pair-wise t-tests are conducted to compare the two cases based on different performance measures. The results showed that sensor embedded products improve revenue and profit while achieving significant reductions in backorder, disassembly, disposal, holding, testing and transportation costs. While the paper addresses the EOL processing of dish washers and dryers, the approach provided could be extended to any other industrial product. - repairing or refurbishing. In remanufacturing, majority of labor, energy and material values embedded in an EOL product are recovered because the disassembled parts are used as is in the remanufacturing process. On the other hand, in recycling, only the material is recovered because the EOL products are simply shredded in a recycling facility. Remanufactured products provide superior performance due to replacement of worn-out parts and upgrading of some key parts. That is why many manufacturers are willing to give consumers the same warranty provisions as with the new products. Although replacement of some parts may occur during the repair or refurbishment option, there is no upgrading. Therefore repaired or refurbished products may not provide a superior performance and their warranty provisions are inferior to those of the remanufactured or new products. Although remanufacturing is more sustainable than the traditional way of manufacturing where we only use virgin materials to produce new products, it involves more uncertainty. In a traditional manufacturing system, there are strict requirements to be obeyed by suppliers regarding the quality, quantity and arrival time of components. On the other hand, in remanufacturing, such strict requirements can not be imposed on the quality, quantity and arrival time of EOL products. That is why, determination of the condition, type and quantity of a component before actually disassembling it is not possible. This increases the uncertainty associated with the used component yield. Sensor embedded products which involve sensors embedded into their critical components during the production process can solve this problem by providing information on the condition, type and number of components before actually disassembling them. In this study, we consider the application of SEPs in disassembly of components from EOL appliances for remanufacturing. The impact of SEPs on system performance is analyzed by performing separate experimental design studies based on orthogonal arrays for conventional products (CPs) and SEPs. Detailed discrete event simulation (DES) models of both cases are used to calculate various performance measures under different experimental conditions. Then, the results of pair-wise t-tests comparing the two cases based on different performance measures are presented. The paper is organized as follows. In Section 2, a review of the issues considered in this study is presented. In Section 3, characteristics of the appliance disassembly line are explained. Section 4 and Section 5 explain the details and results of the design of experiments study, respectively. Finally, some conclusions are presented in Section 6. 2. Literature Review Heuristics, tools or methodologies developed for manufacturing systems can not directly be applied to remanufacturing systems in most cases due to unique characteristics of remanufacturing process. Hence, researchers developed novel techniques considering different issues in remanufacturing including logistics [1,2], operations and production management [3,4], design for remanufacturing [5-7] and disassembly [8]. A complete and up-to-date overview of these studies can be found in the reviews by [9] and [10]. Being a crucial step in remanufacturing, disassembly has received increasing attention of researchers. Many studies have been presented on different domains of disassembly including sequencing [11,12], scheduling [13], disassembly line [14,15], disassembly line balancing [16,17], disassembly-to-order systems [18] and design for disassembly [19]. Researchers have also addressed the issues related to the disassembly of different type of products e.g., vehicles [20], electronics [21] and consumer appliances [22]. For detailed information on the different aspects of disassembly, we refer the reader to a couple of recent books [23,24]. There is a vast amount of literature on the use of sensorbased technologies on after-sale product condition monitoring. Starting with the study of [25], different methods of data acquisition from products during product usage were presented by the researchers [26-28]. In all of these studies, the main idea is the use of devices with memory to save monitoring data generated during the product usage. Although most of these studies focus on the development of SEP models, only few researchers presented a cost-benefit analysis. [29] analyzed the trade-off between the higher initial manufacturing cost caused by the use of an electronic data log in products and cost savings from the reuse of used motors. [30] improved the cost-benefit analysis of [29] by considering the limited life of a product design. They showed that, in that case, servicing provides more reusable components compared to EOL recovery of parts. [31] investigated the effectiveness of embedding sensors in computers by comparing several performance measures in the two scenarios-with embedded sensors and without embedded sensors. The performance measures considered include average life cycle cost, average maintenance cost, average disassembly cost, and average downtime of a computer. However, they do not provide a quantitative assessment of the impact of SEPs on these performance measures. Moreover, since only one component of a computer (hard disk) was considered, the disassembly setting does not represent the complexity of a disassembly line which is generally used to disassemble EOL computers. By extending [31], [32] analyzed the effect of SEPs on the performance of an EOL computer disass (...truncated)


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Mehmet Ali Ilgin, Surendra M Gupta, Kenichi Nakashima. Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products, Journal of Remanufacturing, 2011, pp. 7, Volume 1, Issue 1, DOI: 10.1186/2210-4690-1-7